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InGaAs SPAD for Quantum Cryptography (WSSPM)
WSPAD is a Single Photon Avalanche Diode made of InGaAs compound semiconductor to detect 1550nm single photon. <br>Since the SPAD chip can multiply single carrier by millions of times, it can detect a signal composed of single photon. <br>Generally, it is used as a detector for quantum cryptography, especially known as Quantum Key Distribution (QKD) network. <br>WSPAD shows excellent performance such as very low dark count rate (DCR) noise, high detection efficiency, <br>good after-pulse probability (APP). There are two package types. <br>Mini-flat type(WSPAD-M) has advantages of surface-mountable and better heat-dissipation capability compared to TO-8(WSPAD-C).
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InGaAs Quadrant PD (WQPD)
QPD, a large area InGaAs photodiode was developed to improve modern<br>combat capability in Semi-Active Laser(SAL) guidance technology in missile<br>laser seeker. QPD’s surface has four high sensitivity light receiving area which<br>minimizes cross-talk among the receiving areas. QPD also has wide spectral<br>response range in the area of short wavelength infrared and possesses<br>highly effective signal detection rate compared to Silicon based<br>photodiode. QPDs are used in position sensor, beam alignment, beam<br>profiling, signal tracking & stabilization in mobile space communication, and<br>increased usage in automatic position control system for autonomous<br>vehicles.
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InGaAs APD Chip (WLAAPD)
InGaAs avalanche photodiodes(APD) having diameters of 200um and 80um are released for highly sensitive LRF receivers to detect SWIR range.<br>Since an APD has an internal current gain(multiplication), it can be more sensitively operated than PIN by 10 times or more.<br>There are 4-types of APD chips. WLAAPD200F and WLAAPD80F are front-illumination APDs.<br>WLAAPD200B and WLAAPD80B is bottom-illumination APD. Since bottomillumination APD employs round-trip of light signal, <br>the responsivity is better than front-illumination by 20-25%. Furthermore, the capacitance is smaller than the front due to absence of p-bonding pad, <br>the operation speed and sensitivity is better than the front. The bottom-illumination APD chips are flip-chip bonded to quartz substrate. <br>The corresponding TO cans are available.